![]() ![]() Misra, Dissimilar metal weld joints of P91/Ni alloy: microstructural characterization of HAZ of P91 and stress analysis at the weld interfaces. A novel alternative fabrication process without preform manufacturing was developed for carbon short fiber (CSF) reinforced Al based composite by low-pressure infiltration method. Liang, Electrical-potential induced surface wettability of porous metallic nanostructures. Gouge, Solderability study of RABiTS-based YBCO coated conductors. Song, Highly solderability of FeP film in contact with SnAgCu solder. Li, Interconnection method based on solder-filled nanoporous copper as interlayer for high-temperature applications. Goodall, Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam. Lei, Study on the residual stress relieving mechanism of C/C composite-Nb brazed joint by employing a structurally optimized graphene reinforced Cu foam interlayer. Li, Die attach materials with high remelting temperatures created by bonding microparticles at lower temperatures. Pyczak, The transient liquid phase bonding process of a γ-TiAl alloy with brazing solders containing Fe or Ni. Takemoto, High-temperature resistant intermetallic compound joints for Si chips and Cu substrates. Wang, Recent progress in rapid sintering of nanosilver for electronics applications. As part of the European Space Agency (ESA) Future Launchers. Lu, Characterizations of rapid sintered nanosilver joint for attaching power chips. Composite Ring Made of 3D Woven Preform Injected by RTM: From Design to Full Scale Testing. Lu, Reducing migration of sintered Ag for power devices operating at high temperature. Wang, Effect of added Ag on plasticity enhancement of Au80Sn20 eutectic alloys. Composite Preforms Hence the initial MMC preform is sometimes only partially consolidated, sufficient for lay-up purposes, and full density is only achieved in the second processing step. ![]() Li, A novel antioxidant and low-temperature Sn-Zn solder paste based on core-shell structure. Wang, Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding. Lee, A brief review on high-temperature, Pb-free die-attach materials. Ismail, A review on die attach materials for SiC-based high-temperature power devices. Manufacturing near-net shape preforms of fibre-reinforced composites has received growing interest from industry. Cheong, Die attach materials for high temperature applications: a review. Morel, High temperature ageing of microelectronics assemblies with SAC solder joints. Jung, Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders. Tang, Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints. The results show that the preform is a promising die attach material for high-power devices. Different fracture modes were observed at room temperature and high temperature. The novel solder joints also had excellent mechanical properties, with shear strengths of 27.6 MPa at 30 ☌ and 17.1 MPa at 300 ☌, respectively. It was demonstrated that the solder could be completely consumed by reflowing at 250 ☌ for 15 min under a pressure of 3 MPa, raising the melting point of the solder joints to 415 ☌. The nanoporous structures increased the reaction area, and speeded up the consumption of the low-melting-point phase. To form solder joints with high melting point, the Cu-foam/Sn composite preform with nanoporous structures was prepared. However, the residual low-melting-point phase in microporous copper foam limits its ability to sustain at high temperatures as the transient liquid phase does. Remarks: An epoxy tackifier (100% solids) developed to act as an adhesive during the reinforcement lay-up construction and preform production.Copper foam can be used as an interlayer to relieve high residual stresses and enhance the mechanical properties of the solder joints. Sprayed binder system for automated preforming Very good processability during application. Remarks:Reversible process of performing in the temp range of 100 oC - 110 oC. Powder binder suitable for fabric stabilization during RTM injection. Cross-links at a tempertaure of 100 oC and above. Composites consulting company CIKONI (Stuttgart, Germany) has applied its expertise in composites design, finite element (FE) analysis and advanced simulation to offer solutions for automated preforming. ![]() ![]() Remarks:Reversible process of performing in the temp range of 80 oC - 90 oC. Very good compatibility with epoxy resinĬross-linkable binder for parts made with liquid molding processes Power binder for parts made with liquid molding proceses ![]()
0 Comments
Leave a Reply. |